Imprint apparatus and method of controlling the same

ABSTRACT

An imprint apparatus comprises: a dispensing unit that dispenses a liquid to a substrate; a first measurement unit that measures a time from when a signal for causing the liquid to be dispensed is outputted to the dispensing unit until when the dispensed liquid passes through a predetermined position; a second measurement unit that measures a position of the liquid on the substrate that is dispensed by the dispensing unit; and a control unit that controls the measurement by the first measurement unit and the second measurement unit, wherein the control unit performs measurement by the second measurement unit based on a measurement result by the first measurement unit.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to an imprint apparatus and a method ofcontrolling the same.

Description of the Related Art

An imprinting technique is a technique for enabling a transfer of a finepattern on a nanoscopic scale, and is used practically as onenano-lithography technique for volume production of magnetic storagemediums and semiconductor devices. In an imprinting technique, a finepattern is formed on a substrate such as a silicon wafer, a glass plate,or the like using, as an original, a mold on which a fine pattern isformed by using an apparatus such as an electron beam exposureapparatus. This fine pattern is formed by applying an imprint resin ontothe substrate, and causing that resin to be cured in a state in whichthe pattern of the mold is pressed onto the substrate via the resin.

Conventional imprinting techniques include a heat cycle method and aphotocuring method. In a heat cycle method, a thermoplastic imprintresin is heated to a temperature greater than or equal to aglass-transition temperature, and a mold is pressed on substrate via aresin in a state in which fluidity of the resin is heightened. Then apattern is formed by detaching the mold from the resin after cooling.Also, in a photocuring method, an imprint resin of an ultraviolet lightcuring type is used, and the resin is cured by irradiating ultravioletlight in a state in which a mold is pressed to a substrate via theresin. Then the pattern is formed by detaching the mold from the resinafter curing. A heat cycle method is accompanied by an increase intransfer time due to temperature control and a decrease of dimensionalprecision due to temperature change. In contrast to this, no suchproblem exists in the photocuring method. Thus, the photocuring methodis advantageous in volume production of semiconductor devices on ananoscopic scale.

In a case where an apparatus for volume production of semiconductordevices or the like is assumed, there is a demand that a resin beapplied at a desired position and transfer of a pattern be performed inan imprint apparatus in which resin application and pattern transfer arerepeated for every pattern transferred region on a substrate, forexample. In particular, in the case where a resin is applied to asubstrate by an ink-jet method, properties of individual nozzles forapplying the resin fluctuate according to a temporal change, and theposition at which the resin is applied on the substrate shifts. A methodof measuring a resin landing position shift amount based on a result ofmeasuring resin applied on a substrate in order to detect shift of resinapplied on a substrate, and correcting the resin landing position shiftamount has been disclosed (for example, Japanese Patent Laid-Open No.2011-222705).

In a case where a resin landing position shift is corrected based on aresult of measuring a resin applied on a substrate, it is necessary toset a measuring substrate on a substrate stage at each of given decidedtime intervals, and measure landing position shift. For that reason,fluctuation in nozzle properties that arises between measurements cannotbe detected, and until the next measurement, pressing ends up beingperformed with the resin applied at a shifted position. Shortening themeasurement interval in order to increase a real-time nature can beconsidered, but in such a case, productivity will decrease since thenumber of measurements will increase.

SUMMARY OF THE INVENTION

According to one aspect of the present invention, there is provided animprint apparatus, comprising: a dispensing unit configured to dispensea liquid to a substrate; a first measurement unit configured to measurea time from when a signal for causing the liquid to be dispensed isoutputted to the dispensing unit until when the dispensed liquid passesthrough a predetermined position; a second measurement unit configuredto measure a position of the liquid on the substrate that is dispensedby the dispensing unit; and a control unit configured to control themeasurement by the first measurement unit and the second measurementunit, wherein the control unit performs measurement by the secondmeasurement unit based on a measurement result by the first measurementunit.

According to another aspect of the present invention, there is provideda method of controlling an imprint apparatus comprising a dispensingunit for dispensing a liquid to a substrate, the method comprising:performing a first measurement of a time from when a signal for causingthe liquid to be dispensed is outputted to the dispensing unit untilwhen the dispensed liquid passes through a predetermined position; andperforming a second measurement of a position at which the liquid isdispensed by the dispensing unit onto the substrate, based on themeasurement result by the first measurement.

By virtue of the invention of the present application, it is possible toimprove the real-time nature of resin application position measurementwhile suppressing a decrease in throughput, and it becomes possible toapply resin at high precision to a desired region on a substrate.

Further features of the present invention will become apparent from thefollowing description of exemplary embodiments (with reference to theattached drawings).

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of an imprint apparatus according to thepresent invention.

FIG. 2 is a flowchart of an operation of the imprint apparatus accordingto the present invention.

FIG. 3 is a schematic view of a first measurement unit.

FIGS. 4A and 4B are explanatory views regarding a resin applicationposition shift.

FIG. 5 is a flowchart of a measurement by the first measurement unit.

FIG. 6 is a view that illustrates a droplet passing timing in the firstmeasurement unit.

FIGS. 7A and 7B are explanatory views regarding a second measurementunit and a droplet application position correction method.

DESCRIPTION OF THE EMBODIMENTS

FIG. 1 is an overview configuration diagram for describing an embodimentof an imprint apparatus of the present invention. In FIG. 1, a substratestage 4 is provided via a stage driving unit 3 configured by a linearmotor or the like on a base 1. The substrate stage 4 holds a substrate5, and is configured to be able to move. The stage driving unit 3 movesthe substrate stage 4 in an X-axis direction and a Y-axis directionwhich are parallel to the top surface of the base 1. The substrate stage4 maintains a sufficient position accuracy in relation to the base 1 byfeeding back to the stage driving unit 3 position information detectedby a means (not shown) such as an interferometer.

A frame 2 is provided on the base 1, and an imprint module 7 is attachedto the frame 2 via an imprint module (IM) driving unit 8. The imprintmodule 7 holds a mold 6 facing the substrate 5, and has an ultravioletlight irradiation unit (not shown) internally. The mold 6 is configuredby a material that transmits ultraviolet light, and an uneven pattern isformed on the surface facing the substrate 5. The IM driving unit 8raises/lowers the imprint module 7 in a direction (a Z-axis direction inthe figure) that is perpendicular to the surface of the substrate 5, andperforms operations for pressing the mold 6 to a resin (imprintmaterial) applied on the substrate 5, and separating the mold 6 from thesubstrate 5.

Also, in the frame 2, a dispenser 9 which is a resin (liquid) dispensingunit is held so as to face the substrate 5 via a dispenser controller(DC) 10. The dispenser 9 comprises a plurality of nozzles (not shown)that are arranged in an X-axis direction, and is configured to dispenselight curable resin (resist liquid) from each of the nozzles onto thesubstrate 5. The dispensing of resin is controlled by the DC 10. Also,by causing the substrate stage 4 to move in an X-axis direction and aY-axis direction, it is possible to apply resin at any position on thesubstrate 5. The dispenser 9 can move in a Y-axis direction from adispenser stage 13 to a dispensing position at which to dispense lightcurable resin on the substrate 5 and to a retraction position to whichto retract from a position at which it faces the substrate stage 4 toreplace a tank in which the light curable resin is filled. At theretraction position, a first measurement unit 20 for checking a resindispensing condition of the dispenser 9 is set.

Furthermore, in the frame 2, an alignment scope (AS) 11 is fixed so asto face the substrate 5. The AS 11 detects an alignment mark (not shown)provided in the substrate 5, and performs position adjustment betweenthe substrate 5 and the mold 6 based on this detection result. Also, theAS 11 is a second measurement unit that detects a position by capturinga resin dispensed on the substrate 5 or on the substrate stage 4.

The stage driving unit 3, the imprint module 7, the IM driving unit 8,the DC 10, the AS 11, the dispenser stage 13, and the first measurementunit 20 described above are controlled by a central processing unit(CPU) 12, and perform a sequence of imprint operations. The CPU 12controls an imprint operation according to the present embodiment byusing a program and various data stored in a storage unit (not shown)such as a memory.

An overview of the present embodiment will be described. In a case whereresin is applied to the substrate 5 from the dispenser 9, properties ofindividual nozzles fluctuate according to a temporal change, and therebythe resin dispensing speed changes, and it ceases to be possible toapply the resin at the desired position on the substrate 5. The resindispensing speed here affects the time from when the CPU 12 outputs atrigger signal for dispensing the resin until when the resin isdispensed from the nozzle and lands on the substrate. Accordingly, in acase where the dispensing speed becomes slower due to the nozzleproperty fluctuation, this time becomes longer. Accordingly, in thepresent embodiment, first, a measurement of a droplet speed (the timefrom when the trigger signal is outputted until when the droplet passesthrough a predetermined position) is performed by the first measurementunit 20 which is capable of measurement in a short time when replacingthe substrate 5, though the precision is low.

Also, in a case where the speed of the droplet exceeds a threshold, ashift amount of the actual resin application position is measured athigher precision by using the AS 11 (second measurement unit) whichmeasures the droplet position by capturing in an image the resin appliedto the substrate 5. Next, the resin application position shift iscorrected by using the result of the measurement by the AS 11. When theeffect of a temporal change of a nozzle is always measured prior toprocessing of the substrate 5 by the AS 11 alone, this measurement takesa long time because it is necessary to set a substrate 5 for measuringon the substrate stage 4. For that reason, the throughput decreasessignificantly. In other words, compared to the measurement timeaccording to the first measurement unit 20, the measurement timeaccording to the second measurement unit (the AS 11) takes longer. Inthe present embodiment, a configuration in which a measurement isperformed by the second measurement unit (the AS 11) based on the resultof the measurement by the first measurement unit 20 is provided. As aresult, it is possible to measure the effect of a nozzle temporal changeevery time the substrate 5 is replaced while suppressing a decrease inthroughput, and it is possible to efficiently manufacture semiconductordevices with fewer defects. Note that the threshold used when switchingbetween the first measurement unit and the second measurement unit isassumed to be something that is defined in advance, and details thereofwill be described later.

[Operational Flow]

Using the flowchart of FIG. 2, a detailed description of operation inthe imprint apparatus according to the present embodiment will be given.As described above, the operational flow is controlled by the CPU 12using a program and various data stored in a storage unit (not shown)such as a memory.

In step S1100, the imprint apparatus performs a measurement of the resindispensing speed by the first measurement unit 20. This operation isperformed every time a new substrate 5 is set on the substrate stage 4.

FIG. 3 illustrates a state in which the dispenser 9 is positioned nearthe first measurement unit 20 when performing the measurement in stepS1100. In other words, the dispenser 9 is in a state in which it hasmoved to the retraction position. The first measurement unit 20 emits alaser L from a light source 21 approximately parallel to the dispensingsurface of the dispenser 9 near the dispensing surface, and detects thelaser L by a photo detector 22. In FIG. 3, the dotted line indicates thelaser L which is emitted from the light source 21. Also, a container 23for receiving resin dispensed from the dispenser 9 is arranged so as toface the dispense surface.

When the dispensed resin passed through the laser L, the laser L isblocked, and light does not pass through. This light amount change isdetected by the photo detector 22, and thereby it is detected that theresin passed through the laser L, and the droplet dispensing conditionis detected. In the case where the resin does not pass through the laserL, a dispensing failure is determined, and a recovery operation for thedispenser 9 is performed. At that time, in the case where dispensing isbeing performed, but resin did not pass through the laser L within apredetermined time from which the trigger signal is outputted, it may betreated as a dispensing failure. The recovery operation is notparticularly limited, but, for example, a preliminary dispensing of apredetermined amount of resin may be performed, or a suction operationmay be performed.

In the case where an ink-jet method in which the dispenser 9 uses apiezoelectric element (piezoelectric device), since there is a temporalchange of the piezoelectric element, the resin dispensing speed changestogether with time. The result of this is that the position at which theresin is applied on the substrate 5 ends up shifting.

Here, the shift in the resin application position in a case where theresin dispensing speed becomes slower is described using FIGS. 4A and4B. The XYZ axes indicated in FIGS. 4A and 4B are assumed to correspondto those indicated in FIG. 1. In the case where resin is arranged in agrid pattern, when dispensing is normal, the resin is applied to thesubstrate as illustrated in FIG. 4A. In the case where the substratestage is moving in the −X direction, when the dispensing speed for then4 nozzle decreases, the land timing becomes later, and so the position(landing position) at which the resin is applied on the substrate isshifted in the +X direction (FIG. 4B). This shift in the resinapplication position is connected to deterioration in resin thicknessuniformity, and causes pattern defects as a result. Accordingly, it isnecessary to detect the change in resin dispensing speed due to thetemporal change of the piezoelectric element at high precision, andcorrect the resin application position shift.

Conventionally, the first measurement unit has been arranged in order todetect abnormal dispensing. However, a time T3 from when the triggersignal for applying voltage to the piezoelectric element of thedispenser 9 in order to dispense resin is outputted until when thedroplet passes through the laser L can be obtained. The procedure forobtaining the time T3 will be described later. Note that in FIGS. 4A and4B, an example in which a shift occurs in only one of the plurality ofnozzles (n1 to nn) that the dispenser 9 is provided with is illustrated,but there are cases where a shift occurs simultaneously in two or morenozzles, and the shift amounts in the respective nozzles in such a caseare not necessarily fixed.

In step S1200, the imprint apparatus, for each nozzle, performs adetermination as to whether or not the time T3 obtained in step S1100exceeds a particular threshold. Here, as described above, the time T3indicates a time from when the trigger signal is outputted until whenthe droplet passes through the laser L. In a case where there is anozzle for which T3 exceeds the particular threshold (YES in stepS1200), step S1300 is advanced to. In a case where there is no nozzlefor which T3 exceeds the threshold (NO in step S1200), it is notnecessary to perform a correction of the position at which the resin isapplied, and step S1500 is advanced to. Here, in the case where T3exceeds the threshold for even one of the plurality of nozzles, it isassumed that the processing of step S1300 is performed.

In step S1300, the imprint apparatus performs droplet measurement by thesecond measurement unit (the AS 11) to obtain the specific position ofthe resin applied on the substrate 5. Here, the resin applied on thesubstrate 5 is captured, and the resin position is measured. Details ofthe droplet measurement method by the second measurement unit will bedescribed later using FIG. 7A.

In step S1400, the imprint apparatus performs correction of the resinapplication position by shifting the dispensing timing based on theshift amount ΔX of the resin application position for each nozzleobtained in step S1300. The method of correcting the resin applicationposition will be described later using FIG. 7B.

In step S1500, the imprint apparatus performs a pre-transfer step. Here,a processed substrate 5 is unloaded from a pre-processing apparatus (notshown) such as a cleaning apparatus, and the substrate 5 (semiconductorwafer) is conveyed onto the substrate stage 4 by a conveying unit (notshown). After the substrate 5 is carried onto the substrate stage 4, analignment mark (not shown) on the substrate 5 (semiconductor wafer) isdetected by the AS 11, and position adjustment processing between themold 6 and the semiconductor wafer is performed. Position adjustmentprocessing can be performed at high precision by using a known methodrecited in Japanese Patent Laid-Open No. 2008-100507 or Japanese PatentLaid-Open No. 2007-281072, for example.

In step S1600, the imprint apparatus, using the dispensing timingcorrection value, dispenses resin liquid from the dispenser 9, andthereby applies resin to a desired region. The dispensing timingcorrection value will be described later by using FIGS. 7A and 7B.

In step S1700, the imprint apparatus controls the IM driving unit 8 tocause the imprint module 7 to move in a downward direction in theZ-axis, and presses (imprints) the mold 6 to a shot region S of thesubstrate 5 (semiconductor wafer) to which the resin was applied.

In step S1800, the imprint apparatus further pushes down the mold 6 toperform fill processing such that resin spreads through the details ofthe uneven pattern formed on the surface of the mold 6.

In step S1900, the imprint apparatus uses the ultraviolet lightirradiation unit (not shown) integrated into the imprint module 7 toirradiate ultraviolet light onto the resin through the mold 6. Byirradiating the ultraviolet light, the resin filled into the mold 6 iscured. After that, the imprint apparatus controls the IM driving unit 8to cause the imprint module 7 to move in an upward direction in theZ-axis, and pulls (detaches) the mold 6 from the semiconductor wafer(the substrate 5).

In step S2000, the imprint apparatus determines whether or not thepreceding transfer processing is the final shot, in other words whetheror not transfer processing was performed on all shot regions S of thesubstrate 5 (the semiconductor wafer). In the case where it isdetermined that pattern transfer to all of the shot regions S hascompleted (YES in step S2000), this processing flow is terminated. Inthe case where it is determined that pattern transfer to all of the shotregions S has not yet completed (NO in step S2000), step S1600 isreturned to and this processing is repeated.

Details of step S1100 of FIG. 2 will be described using FIG. 5.

In step S1101, the imprint apparatus selects one nozzle for whichmeasurement has yet to be performed in order to perform measurement oneby one for the plurality of nozzles that the dispenser 9 comprises.

In step S1102, the imprint apparatus sends a trigger signal to the DC 10from the CPU 12 in order to dispensing resin from the nozzle selected instep S1101.

In step S1103, in the imprint apparatus, the DC 10, after receiving thetrigger signal, dispenses resin by applying a driving voltage fordriving the piezoelectric element in relation to the selected nozzle.FIG. 6 illustrates an example of a driving voltage. Regarding thedriving voltage, first the voltage is lowered, and liquid is drawn intothe nozzle, and then simultaneously to the liquid surface returning, thevoltage for the piezoelectric element is increased, and by using themomentum when the liquid surface returns, the liquid is pushed out anddispensed.

In step S1104, in the imprint apparatus, the dispensed resin passesthrough the laser L, and the photo detector 22 detects the droplet. Asdescribed above, when the resin passes through the laser L, the laser Lis blocked, and therefore the output of the photo detector 22 decreaseswhen the droplet passes through, as illustrated in the PD output of FIG.6. By detecting this, the photo detector 22 can detect the droplet.

In step S1105, the imprint apparatus calculates a time t3 from thetrigger signal until when the droplet passes. As illustrated in FIG. 6,the time t3 from a timing 601 of the trigger signal until a timing 603at which the droplet passes through the laser L is calculated. The timet3 is the sum of the time t1 from the timing 601 of the trigger signaluntil a timing 602 when an activation signal is inputted and the time t2from the timing 602 until the timing 603.

In step S1106, the imprint apparatus determines whether or not apredetermined number (N times) of measurements were performed on thesame nozzle. If so (YES in step S1106), the processing advances to stepS1107, and if not (NO in step S1106), the processing advances to stepS1102. Note that the predetermined number of times N is not particularlylimited, and it may be specified that one or more measurements beperformed in accordance with detection time and processing precision.

In step S1107, the imprint apparatus calculates the average value T3 ofthe t3 results of the N measurements.

In step S1108, the imprint apparatus determines whether or notmeasurement has completed for all of the plurality of nozzles that thedispenser 9 comprises. When it has completed (YES in step S1108), thisprocessing flow is completed. When it has not completed (NO in stepS1108), step S1101 is returned to, and measurement is performed insequence for the unmeasured nozzles.

By the method described above, the time T3 from the trigger signal untilwhen the droplet passes through the laser L is obtained, and measurementby the first droplet measurement unit 20 completes.

Next, details of step S1300 of FIG. 2 will be described using FIG. 7A.

In step S1301, the imprint apparatus measures the resin applied on thesubstrate 5 by the AS 11 (second droplet measurement unit). Here, it isassumed that the substrate 5 for measurement is loaded, and setting ontothe substrate stage 4 is performed.

In step S1302, the imprint apparatus performs application of resin ontothe substrate 5. The application of resin is performed by controllingthe DC 10 by the CPU 12.

In step S1303, the imprint apparatus controls the stage driving unit 3by the CPU 12, and for calibration, the substrate stage 4 is moved sothat the region to which the resin droplet is applied is positionedimmediately under the AS 11. Then, the imprint apparatus is caused todetect (measure) the resin position by capturing of the region in whichthe applied resin is present by the AS 11.

In step S1304, the imprint apparatus calculates the shift amount ΔX froma reference position of the resin application position based on theresult of the detection by the AS 11. The method of calculating AX isdescribed using FIGS. 4A and 4B. Here, the n4 nozzle is illustrated asan example. The resin dispensing speed for the n4 nozzle becomes slowerdue to the temporal change, and because of the delay in the dropletreaching the substrate 5, the resin is shifted in the −x direction whichis opposite to the direction of movement of the substrate stage 4, as inFIG. 4B. When the reference position is made to be the average in the xdirection of the line of resin dispensed simultaneously, the referencepositions are represented by dotted lines in FIGS. 4A and 4B. Theapplication of resin of the n4 nozzle is shifted by ΔX in relation tothe reference position. It is possible to obtain ΔX for other nozzlessimilarly. This processing flow is then terminated.

Next, details of step S1400 of FIG. 2 will be described using FIG. 7B.

In step S1401, the imprint apparatus stores the shift amount ΔXcalculated in step S1304 of FIG. 7A by the CPU 12 in memory (not shown)as a correction value. Furthermore, the CPU 12, by dividing the resinapplication position shift amount ΔX calculated in step S1304 by themovement speed p[m/s] of the substrate stage 4, the resin dispensingtiming correction amount Δt is calculated for each nozzle. For example,in a case where ΔX is 5 μm, and the movement speed of the substratestage 4 is 1 m/s, the amount of correction of the resin dispensingtiming is 5 μs.

In step S1402, the imprint apparatus stores in a memory (not shown) thecorrection amount Δt for the dispensing timing calculated for eachnozzle by the CPU 12. Furthermore, the CPU 12 uses a waveform thatcauses the stored correction value to be reflected when applying theresin onto the substrate 5 in step S1600. This processing flow is thenterminated.

By performing imprinting by the foregoing method, it is possible tomeasure the effect of nozzle temporal change prior to processing of thesubstrate 5 while suppressing a throughput decrease. As a result, it ispossible to manufacture a semiconductor device with few defectsefficiently.

Embodiment(s) of the present invention can also be realized by acomputer of a system or apparatus that reads out and executes computerexecutable instructions (e.g., one or more programs) recorded on astorage medium (which may also be referred to more fully as a‘non-transitory computer-readable storage medium’) to perform thefunctions of one or more of the above-described embodiment(s) and/orthat includes one or more circuits (e.g., application specificintegrated circuit (ASIC)) for performing the functions of one or moreof the above-described embodiment(s), and by a method performed by thecomputer of the system or apparatus by, for example, reading out andexecuting the computer executable instructions from the storage mediumto perform the functions of one or more of the above-describedembodiment(s) and/or controlling the one or more circuits to perform thefunctions of one or more of the above-described embodiment(s). Thecomputer may comprise one or more processors (e.g., central processingunit (CPU), micro processing unit (MPU)) and may include a network ofseparate computers or separate processors to read out and execute thecomputer executable instructions. The computer executable instructionsmay be provided to the computer, for example, from a network or thestorage medium. The storage medium may include, for example, one or moreof a hard disk, a random-access memory (RAM), a read only memory (ROM),a storage of distributed computing systems, an optical disk (such as acompact disc (CD), digital versatile disc (DVD), or Blu-ray Disc (BD)™),a flash memory device, a memory card, and the like.

While the present invention has been described with reference toexemplary embodiments, it is to be understood that the invention is notlimited to the disclosed exemplary embodiments. The scope of thefollowing claims is to be accorded the broadest interpretation so as toencompass all such modifications and equivalent structures andfunctions.

This application claims the benefit of Japanese Patent Application No.2017-092562, filed May 8, 2017, which is hereby incorporated byreference herein in its entirety.

What is claimed is:
 1. An imprint apparatus, comprising: a dispensingunit configured to dispense a liquid to a substrate; a first measurementunit configured to measure a time from when a signal for causing theliquid to be dispensed is outputted to the dispensing unit until whenthe dispensed liquid passes through a predetermined position; a secondmeasurement unit configured to measure a position of the liquid on thesubstrate that is dispensed by the dispensing unit; and a control unitconfigured to control the measurement by the first measurement unit andthe second measurement unit, wherein the control unit performsmeasurement by the second measurement unit based on a measurement resultby the first measurement unit.
 2. The imprint apparatus according toclaim 1, wherein the control unit performs measurement by the secondmeasurement unit in a case where the time measured by the firstmeasurement unit exceeds a predetermined threshold.
 3. The imprintapparatus according to claim 1, wherein the dispensing unit comprises aplurality of nozzles, and the first measurement unit performsmeasurement with respect to each of the plurality of nozzles.
 4. Theimprint apparatus according to claim 3, wherein the control unitperforms measurement by the second measurement unit in a case where thetime measured by the first measurement unit corresponding to at leastone nozzle exceeds a predetermined threshold.
 5. The imprint apparatusaccording to claim 3, wherein the first measurement unit performsmeasurement a plurality of times in relation to one nozzle, and thecontrol unit uses an average of the plurality of measurements as ameasurement result for the one nozzle.
 6. The imprint apparatusaccording to claim 3, wherein the control unit determines that adispense failure occurred for a nozzle in a case where the time measuredby the first measurement unit exceeds a predetermined value for thenozzle.
 7. The imprint apparatus according to claim 1, furthercomprising: a calculation unit configured to calculate an amount ofcorrection for correcting a timing of dispensing of a liquid by thedispensing unit, based on the measurement result by the secondmeasurement unit; and a correction unit configured to correct a timingof dispensing by the dispensing unit, based on the amount of correctioncalculated by the calculation unit.
 8. The imprint apparatus accordingto claim 1, wherein the control unit causes measurement by the firstmeasurement unit to be performed for each substrate replacement.
 9. Theimprint apparatus according to claim 1, wherein the time of measurementby the first measurement unit is less than the time of measurement bythe second measurement unit.
 10. A method of controlling an imprintapparatus comprising a dispensing unit for dispensing a liquid to asubstrate, the method comprising: performing a first measurement of atime from when a signal for causing the liquid to be dispensed isoutputted to the dispensing unit until when the dispensed liquid passesthrough a predetermined position; and performing a second measurement ofa position at which the liquid is dispensed by the dispensing unit ontothe substrate, based on the measurement result by the first measurement.